UFS 2.2 Embedded Memory
Storage Capacity
Blazing Speed, Fluid Performance
With Write-Booster+ and HPB 2.0+, the UC260 achieves outstanding sequential read/write speeds up to 1050/950MB/s, and random read/write over 200K IOPS. This improves device responsiveness, reduces latency, and delivers a fast, fluid experience.
Smart Management, Uninterrupted Workflows
The UC260 leverages Host Defragmentation Plus (HID+) technology to minimize capacity waste from fragmentation and optimize storage allocation. This innovation improves storage efficiency and performance while reducing latency, ensuring sustained high-speed operation—even during sustained, large-volume data writes—while extending NAND lifespan through.
Extreme Performance, Minimal Power
The UC260 maintains industry-leading performance while reducing flash interface channels to one, cutting power consumption by 30%. This results in longer standby time for terminal devices and minimizes thermal output, alleviating heat dissipation design constraints. The optimized thermal profile ensures comfortable user experience and prolongs device lifespan.
Broad Compatibility, Easy Upgrade
Featuring BGA-153 packaging, the UC260 supports mainstream platforms with 128GB, 256GB, and 512GB options. Its market-proven solution enables pin-to-pin hardware upgrades and firmware backward compatibility, significantly reducing R&D validation costs while accelerating time-to-market for performance-enhanced terminal products.
Xtacking® 4.0 Technology
Leveraging YMTC’s Xtacking® 4.0 technology, the UC260 integrates 3D NAND flash with superior I/O speed, higher density, and enhanced quality, setting a new standard for embedded storage.
*Note: All performance data is based on internal testing by YMTC
| Product Model | UC260 | ||
| Capacity | 128GB | 256GB | 512GB |
| UFS Protocol | 2.2 | ||
| M-PHY Interface | 3.1 | ||
| UniPro Protocol | 1.61 | ||
| Working Voltage (V) | VCC: 2.7~3.6,VCCQ2: 1.7~1.95 | ||
| Sequential Read (MB/s) | 1050 | 1050 | 1050 |
| Sequential Write (MB/s) | 940 | 950 | 950 |
| Moisture Sensitivity Levels | MSL3 | ||
| Storage Temperature( °C ) | -40~85 | ||
| Working Temperature( °C ) | -25~85 | ||
| Dimension for Encapsulation (Length×Width×Height) | BGA-153, 11.5x13.0x0.8 | ||
*The above performance is verified with YMTC’s internal test platform. Actual results may vary among different host devices and testing conditions.
For more information,please fill in the form below