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UFS 2.2 Embedded Memory

YMTC UC260
The YMTC UC260 is the industry's first UFS 2.2 embedded memory offering an ultra-large 512GB capacity, purpose-built by YMTC for smartphones, tablets, and other intelligent devices. Combining high performance and low power consumption, it reduces boot time, accelerates app loading and switching, reduces heat, and extends battery life—empowering partners to build more competitive products with smoother experience. Powered by YMTC’s Xtacking® 4.0 technology, the UC260 delivers robust quality and cost-effective integration, making it the premier smart choice for next-generation intelligent devices.

Storage Capacity

128GB
256GB
512GB
Technical Support
Related Products
Product Details

Blazing Speed, Fluid Performance

With Write-Booster+ and HPB 2.0+, the UC260 achieves outstanding sequential read/write speeds up to 1050/950MB/s, and random read/write over 200K IOPS. This improves device responsiveness, reduces latency, and delivers a fast, fluid experience.


Smart Management, Uninterrupted Workflows

The UC260 leverages Host Defragmentation Plus (HID+) technology to minimize capacity waste from fragmentation and optimize storage allocation. This innovation improves storage efficiency and performance while reducing latency, ensuring sustained high-speed operation—even during sustained, large-volume data writes—while extending NAND lifespan through.


Extreme Performance, Minimal Power

The UC260 maintains industry-leading performance while reducing flash interface channels to one, cutting power consumption by 30%. This results in longer standby time for terminal devices and minimizes thermal output, alleviating heat dissipation design constraints. The optimized thermal profile ensures comfortable user experience and prolongs device lifespan.


Broad Compatibility, Easy Upgrade

Featuring BGA-153 packaging, the UC260 supports mainstream platforms with 128GB, 256GB, and 512GB options. Its market-proven solution enables pin-to-pin hardware upgrades and firmware backward compatibility, significantly reducing R&D validation costs while accelerating time-to-market for performance-enhanced terminal products.


Xtacking® 4.0 Technology

Leveraging YMTC’s Xtacking® 4.0 technology, the UC260 integrates 3D NAND flash with superior I/O speed, higher density, and enhanced quality, setting a new standard for embedded storage.


*Note: All performance data is based on internal testing by YMTC


Technical Specifications
Product ModelUC260
Capacity128GB256GB512GB
UFS Protocol2.2
M-PHY Interface 3.1
UniPro Protocol1.61
Working Voltage (V) VCC: 2.7~3.6,VCCQ2: 1.7~1.95
Sequential Read (MB/s)105010501050
Sequential Write (MB/s)940950950
Moisture Sensitivity LevelsMSL3
Storage Temperature( °C )-40~85
Working Temperature( °C )-25~85
Dimension for Encapsulation (Length×Width×Height)

BGA-153,

11.5x13.0x0.8




Note:

*The above performance is verified with YMTC’s internal test platform. Actual results may vary among different host devices and testing conditions.

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