We strive to become a global leading
3D NAND flash memory solution provider
In October 2017, YMTC designed and manufactured China's first 3D NAND flash memory through independent R&D and international cooperation. In September 2019, our Gen2 3D NAND Flash memory with innovative YMTC Xtacking® architecture was officially put into mass production. In April 2020, YMTC launched two Gen3 Flash memory chips.As the first QLC based Gen3 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released Flash memory parts in the industry.
Note: 1. Refers to the 3D NAND Flash memory products on the market currently.
YMTC has R&D centers in Wuhan, Shanghai, Beijing and other cities. It is supported by more than 8,000 employees worldwide, including 5,000 R&D engineers. Through persistence and innovation, YMTC strives to become a global leading 3D NAND flash memory solution provider.