Company Vision
Become a leader in storage technology
Core value contributors of global semiconductor industry
Core value contributors of global semiconductor industry
Yangtze Memory Technologies Co., Ltd. (YMTC), established in Wuhan, China in July 2016, is an IDM focusing on the design and manufacturing of 3D NAND flash memory, and is a professional advanced memory solutions provider recognized by global customers. Our products and solutions for global partners range from 3D NAND Flash memory wafers and packaged chips to embedded memory solutions, consumer and enterprise SSDs, which are widely used in mobile devices, consumer electronics, computers, servers, and data centers. On FMS 2018, YMTC debuted its groundbreaking Xtacking architecture and unleashed the potential of 3D NAND.
19 years
Integrated Circuit12 years
3D NAND R&D and ManufacturingMilestones
2014
Launch of 3D NAND R&D
2015
9L Test Chip Design Completed
2016
YMTC Gen 1 3D NAND Test Chip Design Completed
Establishment of YMTC
Establishment of YMTC
2017
YMTC Gen 1 3D NAND (X0-A030) Design Completed and Samples Delivered
2018
YMTC Gen 2 3D NAND (X1-9050) Design Completed
Xtacking™ debuted at FMS 2018 and won“Best of Show” Award
YMTC Gen 1 3D NAND (X0-A030) Mass Production Commenced
Xtacking™ debuted at FMS 2018 and won“Best of Show” Award
YMTC Gen 1 3D NAND (X0-A030) Mass Production Commenced
2019
YMTC Gen 2 3D NAND (X1-9050) Mass Production
YMTC Gen 3 TLC 3D NAND (X2-9060) Design Completed
YMTC Gen 3 TLC 3D NAND (X2-9060) Design Completed
2020
YMTC Gen 3 QLC 3D NAND (X2-6070) Design Completed
ZHITAI Consumer Grade SSD Launch
eMMC/UFS User Sample Quality Evaluation Completed
ZHITAI Consumer Grade SSD Launch
eMMC/UFS User Sample Quality Evaluation Completed
2021
YMTC Gen 3 TLC/QLC NAND (X2-9060/ X2-6070) Mass Produced
ZHITAI Rebranding
ZHITAI Rebranding
2022
Gen3 NAND System Solutions Launch
YMTC Gen 4 TLC 3D NAND (X3-9060/X3-9070) Mass Produced
Xtacking®3.0 won the “Most Innovative Memory Technology Award” at FMS 2022
YMTC Gen 4 TLC 3D NAND (X3-9060/X3-9070) Mass Produced
Xtacking®3.0 won the “Most Innovative Memory Technology Award” at FMS 2022
2023
Gen 4 TLC/QLC NAND (X3-9060/X3-9070/X3-6070) Mass Market Launch
2024
Gen 5 TLC 3D NAND (X4-9060/X4-9070) Mass Produced
2025
Gen 5 QLC 3D NAND (X4-6080) Debuted
Xtacking®4.0 won the “Most Innovative Technology Award” at FMS 2025
Xtacking®4.0 won the “Most Innovative Technology Award” at FMS 2025
Our Mission
We are dedicated to preserving your precious memories.
We are dedicated to preserving your precious memories.
We strive to become a global leading
3D NAND flash memory solution provider
3D NAND flash memory solution provider
In October 2017, YMTC designed and manufactured China's first 3D NAND flash memory through independent R&D and international cooperation. In September 2019, our Gen2 3D NAND Flash memory with innovative YMTC Xtacking® architecture was officially put into mass production. In April 2020, YMTC launched two Gen3 Flash memory chips.As the first QLC based Gen3 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released Flash memory parts in the industry.
YMTC has R&D centers in Wuhan, Beijing and other cities. It is supported by more than 8,000 R&D engineers. Through persistence and innovation, YMTC strives to become a global leading 3D NAND flash memory solution provider.
YMTC has R&D centers in Wuhan, Beijing and other cities. It is supported by more than 8,000 R&D engineers. Through persistence and innovation, YMTC strives to become a global leading 3D NAND flash memory solution provider.
+
Patent Applications
+
Engineers
YMTC Patents
More than
Patent Applications
More than
International Patent Applications
Including
%
of Invention Patent Applications
Annual Increase of
Patent Applications