Company Vision
Become a leader in storage technology
Core value contributors of global semiconductor industry
Core value contributors of global semiconductor industry
Yangtze Memory Technologies Co., Ltd. (YMTC), established in Wuhan, China in July 2016, is an IDM focusing on the design and manufacturing of 3D NAND flash memory, and is a professional advanced memory solutions provider recognized by global customers. Our products and solutions for global partners range from 3D NAND Flash memory wafers and packaged chips to embedded memory solutions, consumer and enterprise SSDs, which are widely used in mobile devices, consumer electronics, computers, servers, and data centers. On FMS 2018, YMTC debuted its groundbreaking Xtacking architecture and unleashed the potential of 3D NAND.
19 years
Integrated Circuit12 years
3D NAND R&D and ManufacturingMilestones
2014
YMTC 3D NAND project was chartered
2015
9-layer 3D NAND flash memory test chip passed the electrical performance verification
2016
YMTC Gen 1 3D NAND flash test chip design completed
YMTC was established
YMTC was established
2017
YMTC Gen 1 3D NAND (X0-A030) completed tape-out and achieved 1st silicon
2018
YMTC Gen 2 3D NAND (X1-9050) achieved 1st silicon
Xtacking™ debuted at FMS 2018 and won“Best of Show” Award
YMTC Gen 1 3D NAND (X0-A030) commenced mass production
Xtacking™ debuted at FMS 2018 and won“Best of Show” Award
YMTC Gen 1 3D NAND (X0-A030) commenced mass production
2019
YMTC Gen 2 3D NAND (X1-9050) mass produced
YMTC Gen 3 TLC 3D NAND (X2-9060) achieved 1st silicon and completed tape-out
YMTC Gen 3 TLC 3D NAND (X2-9060) achieved 1st silicon and completed tape-out
2020
YMTC Gen 3 QLC 3D NAND (X2-6070) design completed
ZHITAI, YMTC's retail storage brand, has been launched
eMMC/UFS embedded memory passed sample verification
ZHITAI, YMTC's retail storage brand, has been launched
eMMC/UFS embedded memory passed sample verification
2021
YMTC Gen 3 TLC/QLC NAND (X2-9060/ X2-6070) mass produced
eMMC/UFS commenced shipment
eMMC/UFS commenced shipment
2022
Officially released advanced system solutions built on third-generation 3D NAND
YMTC Gen 4 TLC 3D NAND (X3-9070) successfully developed
Xtacking®3.0 won the “Most Innovative Memory Technology Award” at FMS 2022
YMTC Gen 4 TLC 3D NAND (X3-9070) successfully developed
Xtacking®3.0 won the “Most Innovative Memory Technology Award” at FMS 2022
2023
Commenced mass production of Gen 4 TLC/QLC NAND (X3-9070/X3-9060)
2024
Gen 5 TLC 3D NAND (X4-9060) successfully developed and mass produced
2025
Gen 5 QLC 3D NAND (X4-6080) successfully developed and mass produced
Xtacking®4.0 won the “Most Innovative Technology Award” at FMS 2025
Xtacking®4.0 won the “Most Innovative Technology Award” at FMS 2025
Our Mission
We are dedicated to preserving your precious memories.
We are dedicated to preserving your precious memories.
We strive to become a global leading
3D NAND flash memory solution provider
3D NAND flash memory solution provider
In October 2017, YMTC designed and manufactured China's first 3D NAND flash memory through independent R&D and international cooperation. In September 2019, our Gen2 3D NAND Flash memory with innovative YMTC Xtacking® architecture was officially put into mass production. In April 2020, YMTC launched two Gen3 Flash memory chips.As the first QLC based Gen3 3D NAND, X2-6070 has achieved the highest bit density, highest I/O speed and highest capacity so far among all released Flash memory parts in the industry.
YMTC has R&D centers in Wuhan, Beijing and other cities. It is supported by more than 8,000 employees worldwide, including 6,000 R&D engineers. Through persistence and innovation, YMTC strives to become a global leading 3D NAND flash memory solution provider.
YMTC has R&D centers in Wuhan, Beijing and other cities. It is supported by more than 8,000 employees worldwide, including 6,000 R&D engineers. Through persistence and innovation, YMTC strives to become a global leading 3D NAND flash memory solution provider.
+
Patent Applications
+
Engineers
YMTC Patents
More than
Patent Applications
More than
International Patents
Including
%
of Invention Patents
Annual Increase of
Patent Applications