Yangtze Memory Technologies to Debut New 3D NAND Architecture and Deliver Keynote at Flash Memory Summit 2018
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- Date: 2018-07-25
New entrant to participate in the high-entry-barrier NAND flash memory industry with its innovative patent-pending XtackingTM architecture
Wuhan, China, July 25, 2018 - Yangtze Memory Technologies Co., Ltd (YMTC), a new player in the NAND industry, will be joining Flash Memory Summit this year for the first time, delivering a much-anticipated keynote address to reveal its ground-breaking technology - XtackingTM. YMTC is the first Chinese company to take part in the high-entry-barrier NAND flash memory industry with its new architecture for unprecedented performance, higher bit density, and faster time-to-market.
Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND’s Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company’s new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.
The XtackingTM technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, XtackingTM will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.
The XtackingTM technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.
About Yangtze Memory Technologies Co., Ltd (YMTC):
Founded in 2016 with $24B funding, Yangtze Memory Technologies Co., Ltd. (YMTC) is a memory solutions company headquartered in Wuhan, China. YMTC designs, manufactures and sells memory products and solutions for a broad range of applications including mobile devices, computing, data centers and consumer electronics for customers around the world.
Leveraging its wholly-owned subsidiary XMC’s existing 12-inch IC fab in Wuhan, its more than 10 years of memory and specialty IC R&D experience, and international partnerships, YMTC successfully designed and manufactured the first 32-layer 3D NAND flash chip in 2017. With over 3,000 employees and worldwide R&D centers, YMTC is committed to becoming a world leading memory solutions provider through technology innovations.