Embedded Memory
Storage Capacity
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Tel.+86 27 65320000
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E-mail:YMTC@ymtc.com
Robust Endurance
Powered by advanced X4-9060 3D NAND technology and offering 256TBW endurance (256GB), EC150 significantly extends device life cycles while reducing maintenance costs, enhancing edge devices competitiveness in high-write workload.
Enhanced Endurance | Ultra-low Power Consumption
LDPC ECC detects and corrects data errors, while its also can reduce power consumption. EC150’s slimmer thermal designs and longer battery life in portable devices create better user experience.
Industry-leading Performance
Leveraging YMTC’s Xtacking® 4.0 technology, the EC150 integrates 3D NAND flash with 3600 MT/s high-speed interface and AMPI (Advanced Multi-Plane Interleave) technology delivers up to 26K IOPS 4K random read performance (128GB), providing a smooth experience for users.
Proven Stability | Wide Compatibility
With standardized BGA153 package compliant with JEDEC specifications, EC150 is available in 64/128/256GB capacities to support flexible BOM configurations.
EC150 adopts a mature product solution, pre-validated on mainstream SoC platforms, the EC150 reduces verification costs and accelerates time to market.
| Product Mode | EC150 | ||
| eMMC Interface | eMMC 5.1 | ||
| Capacity | 64GB | 128GB | 256GB |
| Clock Mode | SDR/DDR/HS200/HS400 | ||
| Operating Voltage（V） | VCC: 2.7~3.6V VCCQ: 1.7~1.95V | ||
| Sequential Read（MB/s） | 320 | 320 | 320 |
| Sequential Write（MB/s） | 280 | 280 | 280 |
| Random Read up to（IOPS） | 28K | 28K | 28K |
| Random Write up to （IOPS） | 26K | 26K | 26K |
| Working Temperature（℃） | -25°C ~ 85°C | ||
| Dimension for Encapsulation (Length×Width×Height) | BGA-153, 11.5 x 13 (HZ -> 1.0mm) | ||
*Note: All performance data is based on internal testing by YMTC
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