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UFS 3.1 Embedded Memory

YMTC UC341
The UC341 is YMTC’s new embedded storage product, follows the JEDEC UFS 3.1 standard. It leverages YMTC’s Xtacking® 3.0 , featuring advanced TLC 3D NAND technology for industry-leading performance with low power consumption, and exceptional reliability,equipped with innovative technologies such as Multi-Level Autonomous Optimization (Hint HID) and Trace Logging (Trace Dump). offers128GB, 256GB, and 512GB capacities。The UC341 solution is mature, reliable, and offers stable supply, making it an ideal solution for flagship smartphones, slim laptops, VR/AR devices, and other AIoT applications.

Storage Capacity

128GB
256GB
512GB
Technical Support
Related Products
Product Details

High Performance for Superior User Experience

The UC341 delivers industry-leading performance enabling rapid data access and efficient command execution. This solution provides users with a superior, seamless storage experience 

     

Enhanced Power Efficiency

The UC341 is engineered with low-power design with power-efficiency that surpasses  industry average. Even under heavy workloads such as gaming, video streaming, and social media, it minimizes heat generation, extends battery life, and significantly enhances overall user experience.


Innovative Features: Hint-HID and Trace Logging

Hint Host Initiated Defrag (Hint HID): This newly-upgraded feature intelligently detects fragmented files and automates self-management. By optimizing read/write performance for fragmented files, the Hint HID effectively reduces system lags for smoother performance.

Trace Dump: This feature logs command sequences and system states in real-time during errors, enabling swift root-cause analysis in addition to providing critical data for device maintenance.


Xtacking® 3.0 Technology

Leveraging YMTC’s Xtacking® 3.0 technology, the UC341 incorporates 3D NAND flash with superior I/O speed, higher density, and enhanced quality, 


Sophisticated Solutions with Stable Supply Chain

The UC341 features a sophisticated and dependable design, refined through multiple iterations of technical advancements. Manufactured in-house by YMTC, it ensures a secure and stable supply chain forcustomers..

Technical Specifications
Capacity128GB256GB512GB
InterfaceUFS 3.1
M-PHY Interface4.1
UniPro Protocol1.8
Working Voltage (V)VCC: 2.4~2.7,VCCQ: 1.14~1.26
Sequential Read (MB/s)2,0002,0002,000
 Sequential Write (MB/s)1,6001,9001,900

Storage Temperature (°C ) 

Working Temperature (°C )

-40-85;-25-85






Note:

The above performance is verified with YMTC’s internal test platform. Actual results may vary among different host devices and testing conditions.

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